| 发明名称 |
Method to encapsulate metallic conductors of microelectronic components in plastic |
| 摘要 |
Process for embedding metallic conductors of microelectronic components into a plastic composition comprises roughening the conducting pathways to be embedded by physical and/or chemical process, and surrounding the conducting pathways in the roughened region by the plastic composition. |
| 申请公布号 |
EP0893822(A3) |
申请公布日期 |
2000.11.22 |
| 申请号 |
EP19980112471 |
申请日期 |
1998.07.06 |
| 申请人 |
DAIMLERCHRYSLER AG |
发明人 |
WARTUSCH, JOHANN;MERKEL, KARL-HEINZ;RENTSCH, ARNO |
| 分类号 |
B29C37/00;B29C70/68;H01L23/10;H01L23/29;H01L23/495 |
主分类号 |
B29C37/00 |
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