METHOD FOR SINGLE-SIDE POLISHING OF FLAT SURFACES OF PARTS

摘要

finish working of precision flat surfaces, particularly chemical and mechanical polishing of large-diameter silicon plates. SUBSTANCE: silicon plates are mounted with possibility of rotation around their axes and axis of spindle and they are arranged eccentrically relative to rotation axis of spindle. Relation of rotation numbers of spindle and polishing tool is selected in range (0.5-0.9) or (1.1-1.5). Parts are mounted with possibility of self-aligning along surface of tool to start rotation around their own axis. In order to provide equal material removal along the whole surface, rotation number of parts around their own axis is selected in range (0.3-8) rev/min. It allows to maintain initial geometry of plate after chemical and mechanical polishing, for example its thickness difference and local out-of-planeness achieved at operation of double-side grinding. EFFECT: enhanced quality of polishing. 1 dwg, 1 ex