| 摘要 |
<p>A component mounting apparatus and a method therefor, capable of mounting an electronic component upside down in a short mounting-tact time by picking up the electronic component, delivering/receiving it between heads, and mounting it on a circuit board in parallel. A plurality of inverting feed heads (25) are mounted on a component feed holder (24) which conducts an index rotation, and a plurality of mounting heads (33) are mounted on a component mounting holder which conducts index rotation synchronously. In specified positions, (a) an electronic component (19) is picked up, (b) the electronic component is transferred from an inverting feed head to a mounting head, and (c) the electronic component (14) is mounted on a circuit board (15). Therefore, it is possible to practice the steps (a) to (b) in parallel, and to mount the electronic component on the circuit board in a short tact time.</p> |
