SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to reduce a volume of electronic equipment a semiconductor package by using a thin semiconductor package. CONSTITUTION: A semiconductor package comprises a substrate, a first semiconductor chip(20), a second semiconductor chip(30), a connection portion, and a packing material. The substrate is formed with a conductive circuit pattern(13) and a multitude of penetrating hole. The first semiconductor chip is formed at a bottom portion of the substrate. The second semiconductor chip is formed at an upper face corresponding to the first semiconductor. The connection portion connects electrically the first semiconductor chip and the second semiconductor chip with the circuit pattern. The packing material protects the first and the second semiconductor chips and the connection portion from outer circumferences.