| 摘要 |
PROBLEM TO BE SOLVED: To prevent erroneous solderings, such as bridging, undoped soldering, and the like in soldering leads of a flat package IC to the connection lands of a circuit board through an immersion method. SOLUTION: The length of connection lands 16 are formed sequentially longer one after another along the carrying direction of a circuit board 15 to be soldered by the immersion method and the lands 20 for absorption behind the connection lands 16 to be contacted by fused solder last are arranged, and moreover the ends of the connection lands 16 are formed in a slanted part 17, as necessary.
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