| 摘要 |
The invention relates to a circuit board with an arrangement for cooling power components (1), which circuit board has at least one conductive layer (2) for supplying signals and/or current to the active and other components installed on the circuit board, one primary cooling layer (3), and an insulating material (4) which insulates the conductive layers (2) and the primary cooling layer (3) from each other and binds the circuit board, whereby one or more heat-generating power components (1) having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer (3) in order to cool the heat-generating power components (1) on the circuit board. The circuit board has at least one secondary cooling layer (5) which is galvanically insulated from the primary cooling layer (3), and one or more heat-generating power components (1) having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer (5) in order to cool the heat-generating power components (1) on the circuit board. |
