| 摘要 |
An apparatus and a method are provided for inspecting the edge micro-texture of a semiconductor wafer. The apparatus includes a diffuse hemisphere having at least one access port and has a normal axis, a laser target sphere mounted within the hemisphere, and a laser source directing a laser beam to the laser target sphere and forming a laser spot on the laser target sphere. The laser beam is reflected from the laser target sphere. A wafer chuck presents a wafer edge to the reflected laser beam, with the wafer edge being tilted from the normal axis; and there is at least one camera for detecting radiation leaving the access port. The method includes directing a laser beam to a laser target sphere which is mounted within a diffuse hemisphere; the laser beam forming a laser spot on the laser target sphere is reflected from the laser target sphere to the edge of a wafer; and radiation which leaves the hemisphere through at least one access port of the hemisphere is detected with at least one camera.
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