发明名称 CURABLE RESIN COMPOSITION FOR ADHESION AND ITS PREPARATION
摘要 PROBLEM TO BE SOLVED: To obtain a curable resin composition for adhesive which has an excellent productivity, workability and heat stability and exerts a good adhesion property which leads to the breakage of FRP materials, even under an elevated temperature atmosphere, and to provide a its preparation process. SOLUTION: A curable resin composition for adhesion is prepared by adding an isocyanate compound (D), a hardener (E) and an accelerator (F) to a resin composition (C) comprising a radically polymeriable composition (A) containing a (meth)acryloyl group and a butadiene/acrylonitrile copolymer in a molecule and a radically polymerizable unsaturated monomer (B). In a preparation process of a curable resin composition for adhesion, this component (A) and component (B) are mixed to obtain the resin composition (C), which is subsequently added with components (D), (E) and (F).
申请公布号 JP2000313869(A) 申请公布日期 2000.11.14
申请号 JP19990123727 申请日期 1999.04.30
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 MAEDA TAKESHI;SATO HIKARI
分类号 C09J175/00;C09J109/02;(IPC1-7):C09J175/00 主分类号 C09J175/00
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