| 摘要 |
PROBLEM TO BE SOLVED: To improve the positioning accuracy of a 2nd object relative to a 1st object while suppressing the increase of manufacturing cost and maintenance cost. SOLUTION: In the case of positioning a soldering ball on a land of a semiconductor element formed on a semiconductor wafer 1, the position and posture of the land and the ball are first detected by respective cameras 8, 7, an X axis carrier 5 and a Y axis carrier 12 are moved on the basis of the detected results and a rotary table is rotated. Then a Z axis carrier 10 is moved to mount the ball on the land. The positional deviation of the ball is detected by the camera 8 and stored in an offset memory 14b. In the case of mounting a soldering ball on the land of another semiconductor wafer 1, the moving distances of the X-axis and Y-axis carriers 5, 12 and the rotational angle of the table 3 are calculated on the basis of the detected results of the cameras 8, 7 and the positional deviation stored in the memory 14b. Consequently, the soldering ball can be mounted without generating a positional deviation.
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