| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method with which a semiconductor device can be manufactured without impairing reliability even when a chipping is generated on the side face part on the circumference of a semiconductor device while various types of reliability tests, especially a moisture absorbing test, in performed. SOLUTION: After a semiconductor chip 1 has been face-down mounted on a wiring substrate, the first sealing resin 11 is implanted into the gap between the semiconductor chip 1 and the wiring substrate, and the sealing resin 11 is hardened. Besides, after a polishing process has been finished, the second sealing resin 12 is applied and hardened covering the side face part on the circumference of the semiconductor chip 1, and even when a part of the side face part of the semiconductor chip 1 is chipped and cracked in the polishing process, a gap is not formed between the sealing resin and the side face part of the semiconductor chip, because the second sealing resin 12 is applied to the chipped part.</p> |
