发明名称 |
PLASMA TREATMENT METHOD AND PLASMA TREATMENT APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treatment method which make plasma generation and retention easy in a desired region and enables plasma treatment at a high power and high electric power efficiency. SOLUTION: This plasma treatment method is to carry out plasma treatment by generating first plasma between a pair of electrodes by applying high frequency voltage to the electrodes and causing reaction of the first plasma on an object to be treated in a first region and comprises a first step (S701) of generating second plasma in a second region different from the first region and a second step (S703) of generating the first plasma in the first region. The second region is made smaller than the first region. |
申请公布号 |
JP2000312822(A) |
申请公布日期 |
2000.11.14 |
申请号 |
JP20000040364 |
申请日期 |
2000.02.17 |
申请人 |
SHARP CORP;MORI YUZO |
发明人 |
NISHIKAWA KAZUHIRO;OKUDA TORU;MORI YUZO |
分类号 |
H01L21/302;B01J19/08;H01L21/205;H01L21/3065;H05H1/46 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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