发明名称 PLASMA TREATMENT METHOD AND PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment method which make plasma generation and retention easy in a desired region and enables plasma treatment at a high power and high electric power efficiency. SOLUTION: This plasma treatment method is to carry out plasma treatment by generating first plasma between a pair of electrodes by applying high frequency voltage to the electrodes and causing reaction of the first plasma on an object to be treated in a first region and comprises a first step (S701) of generating second plasma in a second region different from the first region and a second step (S703) of generating the first plasma in the first region. The second region is made smaller than the first region.
申请公布号 JP2000312822(A) 申请公布日期 2000.11.14
申请号 JP20000040364 申请日期 2000.02.17
申请人 SHARP CORP;MORI YUZO 发明人 NISHIKAWA KAZUHIRO;OKUDA TORU;MORI YUZO
分类号 H01L21/302;B01J19/08;H01L21/205;H01L21/3065;H05H1/46 主分类号 H01L21/302
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