| 摘要 |
The invention relates to a method of placing components (3) on substrates (2) by means of pick-and-place devices (1, 7, 8). Before the components are placed, a pick-and-place program is determined in a manner known per se by which a maximum pick-and-place efficiency can be obtained. Said program is based on a theoretical time response of the individual pick-and-place devices (1, 7, 8). According to the invention, observer elements (32, 35, 38) are provided in the control devices (16, 22, 23) of pick-and-place devices (1, 7, 8) that are mounted in line. Said observer elements measure the actual time response of the pick-and-place devices (1, 7, 8). On the basis of said actual time response, an improved pick-and-place program is determined which operates the individual pick-and-place devices (1, 7, 8) or the line of pick-and-place devices. According to this improved pick-and-place program the components (3) to be placed are newly allocated to pick-up stations (6, 17). |
