| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device and a manufacturing method thereof, whereby a semiconductor element is tightly fixed to an insulation substrate through a resin filler to protect the semiconductor element, and the electrodes of the semiconductor element are completely electrically connected to wiring conductors to enable the semiconductor element to stably operate for a long time. SOLUTION: This semiconductor device has a semiconductor element 3 mounted on an insulation substrate 1 by the flip-chip connection method, and a resin filler 4 is filled between the substrate 1 and the semiconductor element 3 and penetrates also into notches 1b which are cut into the side face of the substrate 1. The filler 4 is three-dimensionally engaged firmly to the substrate 1 to effectively block the filler 4 from peeling from the peripheral edge of the substrate 1, even if thermal stresses act on it. |
