| 摘要 |
A printed circuit assembly includes a printed circuit board with an electrically conductive via formed therein that extends from the front side of the printed circuit board to the back side of the printed circuit board. A ball grid array package mounted to the front side of the printed circuit board is electrically connected to the electrically conductive via. A probe pad formed on the back side of the printed circuit board is laterally displaced from the electrically conductive via and is electrically connected thereto. A solder mask layer deposited on the back side of the printed circuit board includes a probe pad aperture formed therein that is substantially aligned with the probe pad so that the probe pad is exposed by the probe pad aperture formed in the solder mask layer.
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