| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily manufacture without generating insulating failure between a gate electrode and a cathode conductor. SOLUTION: In this method, a cathode wiring 102, a cathode electrode 103 and an emitter 104 are first laminated on an insulating substrate 101. A gate electrode 703, an insulating rib 704 and an adhesive 705 are laminated on the substrate formed of a reinforcement metal plate 701 and a transfer polypropylene substrate 702. Then, the adhesive 705 is overlapped so as to abut the insulating substrate 101 as the gate electrode 703 is located between the emitters 104. The adhesive 705 is pressed by a roller 801 to transfer the gate electrode 703, etc., on the insulating substrate 101.</p> |
