| 摘要 |
PROBLEM TO BE SOLVED: To maintain stable friction even at a high surface plate speed side and to stabilize the polishing speed by using a brush or dressing tool made of resin during polishing for rubbing or cutting the surface of a polishing pad. SOLUTION: A polishing pad 11 is applied to a surface plate 10 and an abrasive grain free polishing agent is supplied from a supply port 15. A wiring board 100 that is made of a silicon wafer with a diameter of 4 inches where a copper film with a thickness of 1μm is formed on a surface is pressed against the polishing pad 11 via a carrier 12. A dressing tool 16 for in-situ dressing is installed at another part of the surface plate 10 and is rotated while being pressurized. A polishing pressure is set to 200 gf/cm2, a pressure of 110 gf/cm2 is applied to the dressing tool 16, and the wiring board 100 is polished while in-situ dressing is being made. By setting the concentration of an abrasive grain to 0.5 wt.% or less, preferably 0.1 wt.%, the effect for suppressing the generation of a polishing scratch can be increased.
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