发明名称 Wafer polishing with improved backing arrangement
摘要 A wafer carrier includes a porous media layer through which a pressurized fluid is injected. The porous media layer introduces lateral dispersion into the pressurized flow, thereby assuring a uniform pressure at the exit surface of the porous media layer, as when the porous media layer is located adjacent the wafer being polished. Alternatively, an inflatable bladder may be introduced between the porous media layer and the wafer, again with pressure being maintained uniform by the porous media layer.
申请公布号 US6142857(A) 申请公布日期 2000.11.07
申请号 US19980079729 申请日期 1998.05.15
申请人 SPEEDFAM-IPEC CORPORATION 发明人 CESNA, JOSEPH V.
分类号 B24B37/013;B24B37/04;B24B37/16;B24B37/30;B24B41/06;B24B49/12;(IPC1-7):B24B29/00 主分类号 B24B37/013
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