发明名称 |
Silicon-rich block copolymers to achieve unbalanced vias |
摘要 |
An integrated circuit and method for making it is described. The integrated circuit includes an insulating layer, formed within a trench that separates conductive elements of a conductive layer, that has a low dielectric constant. The insulating layer is convertible at least in part into a layer that is resistant to a plasma that may be used for a photoresist ashing step or to a solvent that may be used for a via clean step. Preferably the insulating layer comprises a silicon containing block copolymer that is convertible at least in part into a silicon dioxide layer. The silicon dioxide layer protects the remainder of the insulating layer from subsequent processing, such as photoresist ashing and via clean steps.
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申请公布号 |
US6143647(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19970899133 |
申请日期 |
1997.07.24 |
申请人 |
INTEL CORPORATION |
发明人 |
PAN, CHUANBIN;CHIANG, CHIEN |
分类号 |
H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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