发明名称 |
Leadframe for semiconductor chips and semiconductor module having the lead frame |
摘要 |
A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention. |
申请公布号 |
US6144088(A) |
申请公布日期 |
2000.11.07 |
申请号 |
US19970898734 |
申请日期 |
1997.07.23 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
POHL, JENS;BLUMENAUER, MICHAEL;VIDAL, ULRICH |
分类号 |
H01L23/495;(IPC1-7):H01L23/50;H01L23/28;H01L23/48;H01L29/44 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|