| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a disk-shaped heater capable of forming a uniform temperature distribution in a wafer mounting face, and to provide a wafer heating device using the heater. SOLUTION: This heater has a hollow part 3 inside a disk-shaped insulated base 2, and is provided with a heating element 4 oscillated parallelly or rotated with respect to an upper face serving as a wafer mounting face of the base 2, around a center shaft body 5 provided in the center of the base 2. A heating value of the heating element 4 is increased to be proportional to a distance from the center of the oscillation or rotation, heat generated in the heating element 4 is heat-transferred uniformly to the base 2 located in its upper part by the oscillation or the rotation of the heating element 4 inside the hollow part 3 of the base 2, and a temperature distribution of the wafer mounting face in the insulated base 2 is uniformized as a result thereof.</p> |
