发明名称 DEVELOPING SOLUTION COMPOSITION FOR PHOTOSENSITIVE RESIST
摘要 PROBLEM TO BE SOLVED: To provide the developing solution capable of forming a precise pattern without causing a swelling of cured parts and undercut and peeling and development residues in nonexposed parts and freed of any problem concerning environmental destruction and safety. SOLUTION: This liquid composition in which water is soluble at 20 deg.C in an amount of 3-30 weight %, contains at least one kind of compound selected from a group comprising N-methyl-2-pyrroli-done,γ-butyrolactone, N,N- dimethylformamide, and N,N-dimethyl-acetamide, preferably, in an amount of 1-20 weight % and also contains water.
申请公布号 JP2000310862(A) 申请公布日期 2000.11.07
申请号 JP19990121739 申请日期 1999.04.28
申请人 SANNOPUKO KK 发明人 KOUDA KAZUHIKO
分类号 H01L21/027;G03F7/32;(IPC1-7):G03F7/32 主分类号 H01L21/027
代理机构 代理人
主权项
地址