| 摘要 |
PURPOSE: An epoxy resin adhesive is provided that has excellent heat resistance and shock resistance, as well as adhesiveness to a substrate for a printed circuit. CONSTITUTION: The adhesive comprises 10 to 90 wt% of epoxy resin, 10 to 90 wt% of filler and 1 to 30 wt% of toughening agent as main components; and 0.1 to 20 wt% of curing agents based on the weight of the main components. The epoxy resin is contained in an amount of 35 to 60 wt%, and the filler is contained in an amount of 40 to 65 wt%. The epoxy resin is aliphatic, alicyclic or aromatic epoxy resins and is selected from the group consisting of bisphenol A diglycidylate, bisphenol B diglycidylether, bisphenol F diglycidylether, 1,4-butanediol diglycidylether, resorcinol diglycidyl ether, phenol novolac diglycidylether and cresol novolac diglycidyl ether.
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