| 摘要 |
PURPOSE: A micro burnishing apparatus using ultrasonic waves is provided to increase surface hardness, improve the degree of the surface coarseness and reduce the machining time. CONSTITUTION: A micro burnishing apparatus using ultrasonic waves includes a burnishing head(40) contacting with the surface of a workpiece, a holding element(42) holding the burnishing head, an ultrasonic oscillator(44) fixed in a case(50) for generating the ultrasonic waves applying to the holding element, a high frequency generating element(46) generating high frequency supplied to the ultrasonic wave oscillator, and a pressing element(48) contacting the burnishing head closely to the surface of the workpiece by pressing the holding element.
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