| 摘要 |
PROBLEM TO BE SOLVED: To avoid short circuiting between metal thin wires in electrically connecting electrode pads to a lead frame or a substrate through wire bonding. SOLUTION: For a semiconductor pellet 1 having an integrated circuit formed at a central part, first electrode pads 2 arrayed at a peripheral part, and second electrode pads 3 arrayed parallel to and outside the first electrode pads 2, the first electrode pads 2 array is spaced apart by a distance C from the second electrode pads 3 array and the first electrode pads 2 are disposed with fixed spacings P and their respective electrodes 2, 3 have a width S1, the second electrode pads are connected to wirings of a width L and have a width S2 (P>S2>S1+L) and those electrode pads 3 located within a range of θ>tan-1 (2C/(P-S1)) are located with their centers at mid-positions between the first electrode pads 2, where θ(<90 deg.) is the angle formed by a line extending from the center of the pellet 1, with one side of the pellet 1 and other second electrode pads 3 are located with their centers offset from the mid-positions between the first electrode pads 2 to the corner of the pellet 1. |
