| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a small-sized illuminance sensor at a low cost of which noise-resistance property is improved. SOLUTION: A wire frame 20 is insert-molded in a housing 10, from the side surface of which lead terminal parts P1-P4 protrude outside. The wire frame 20 is formed by bending work after punching work of a sheet metal. An element mounting part 20a, on which each element is mounted, a wiring part 20b electrically connecting parts between elements, and the lead terminal parts P1-P4 are continuously formed integrally. A recessed part 11 on witch each element is mounted is formed on one surface of the housing 10. The element mounting part 20a of the wire frame 20 and the wiring part 20b are exposed on the bottom surface of the recessed part 11. Elements such as a photovoltaic element SB and MOSFETs 1, 2 are mounted on the element mounting part 20a of the wire frame 20.</p> |
