| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device for mounting a semiconductor device part wherein a high-density 3-dimension implementation of a semiconductor device is realized for no distinct signal delay at a first high-frequency device. SOLUTION: A semiconductor chip 7 with a bump electrode wherein its rear surface is made thinner, at least to the thickness of 200μm or less, is flip-chip-mounted to a flexible intermediate substrate 10, and the backsides of semiconductor chips are bonded and secured with an adhesive 15 while the intermediate substrate deflected, which is mounted on a printed wiring board 16. Thus, 3-dimension packaging of ultra-thin lamination for a semiconductor device part is realized at high reliability, for higher function and very small and thin product set of electronic device.</p> |
