| 摘要 |
PROBLEM TO BE SOLVED: To surely pack conductive paste in a via hole formed on a substrate without any clearance. SOLUTION: In a method for packing conductive paste, the diameter (Ka) of the opening face of a through-hole 41 of a hole plate 4 is made smaller than the diameter (Kb) of the opening face of a via hole 10a. For example, a hole diameter rate ((Ka/Kb)×100) is set so as to be 60%. When conductive paste 5 placed on the hole plate 4 is pressed by a stage 6 moving at a prescribed speed, the conductive paste 5 is pushed out from the through-hole 41 of the hole plate 4 to the via hole 10a.
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