发明名称 CIRCUIT BOARD, BATTERY PACK, AND METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 <p>A circuit board (10) comprises a first substrate (11) with a predetermined wiring pattern (16) and a second substrate (12) with a predetermined wiring pattern (17), and they are connected together electrically and/or mechanically and bent in the connection. The connection includes a foldable joint material (13) composed of a thin base film (20) holding a plurality of parallel leads (14), and the joint material (13) connects the first and second substrates (11, 12) together.</p>
申请公布号 WO2000065888(P1) 申请公布日期 2000.11.02
申请号 JP2000002571 申请日期 2000.04.19
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址