发明名称 |
METHOD OF RESIN-SEALING SEMICONDUCTOR DEVICES |
摘要 |
<p>The method according to the present invention is carried out by setting a circuit board (9), on which an IC 15 is mounted, in a cavity (11) of a lower metal mold (2) so that the IC faces in the downward direction, feeding a resin tablet (19) from a pot (21) formed in a position lower than the cavity (11), pressing a molten resin with a plunger (20) and packing the resin in the cavity (11) through a runner (18) and a pinpoint gate formed at a lower portion of the cavity, and pressing a rear surface of the circuit board (9) with a pressing member (3) provided in an upper metal mold, whereby the IC 15 mounted on the circuit board (9) is resin-sealed. Consequently, the present invention makes it possible to prevent the occurrence of residual resin which causes the imperfect packing of the cavity with a resin, improve the productivity of semiconductor devices, and mold semiconductor devices having a high reliability and a high quality. <IMAGE></p> |
申请公布号 |
EP0688650(B1) |
申请公布日期 |
2000.11.02 |
申请号 |
EP19950905230 |
申请日期 |
1995.01.06 |
申请人 |
CITIZEN WATCH CO. LTD. |
发明人 |
YABE, ISAO;YONEYAMA, MASAHIKO;NAYUKI, TERUO;SHIMIZU, HIROAKI;IKAI, KATSUHIKO;ASAUMI, KAZUHIKO |
分类号 |
B29C45/02;B29C45/14;B29C45/38;H01L21/56;(IPC1-7):B29C45/02;B29C45/18;B29C45/26 |
主分类号 |
B29C45/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|