发明名称 BORING METHOD OF COPPER CLAD LAMINATED BOARD AND JIG PLATE FOR BORING
摘要 PROBLEM TO BE SOLVED: To improve warp of an entry board and a backup board by using an unsaturated polyester resin laminated board where uniform heating is performed and warp is negligible. SOLUTION: In this boring method, boring is performed by using a drill in the state that a laminated board which is composed of unsaturated polyester resin and paper and 0.1-2.0 mm in thickness is brought into closely contact with the surface of a copper clad laminated board.
申请公布号 JP2000307214(A) 申请公布日期 2000.11.02
申请号 JP19990154244 申请日期 1999.04.22
申请人 YOKONO HARUKI 发明人 YOKONO HARUKI
分类号 B26F1/16;H05K3/00;(IPC1-7):H05K3/00 主分类号 B26F1/16
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