LEAD FRAME AND MANUFACTURE OF RESIN SEALED SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To prevent generation of resin bur in a land electrode by providing a step part between the forward end of a land lead part and the end connected with a frame by means of a semi-cut press part thereby preventing sealing resin from flowing into the gap between a sealing sheet and the bottom face of the land electrode. SOLUTION: When a pressing force is applied to the frame side at the land lead 4 of a lead frame, bottom face of the land electrode 19 at the land lead 4 is located lower than the bottom face on the other end side because of a step part provided by a semi-cut press part at the land lead 4. Consequently, the regions of a semiconductor element 15, a die pad part 1 and a metal thin wire 17 can be resin sealed 18 on the upper surface side of the lead frame under a state where the bottom face of the land electrode 19 is surely brought into tight contact with a sealing sheet. Consequently, the sealing resin 18 can be prevented from flowing between the sealing sheet and the land electrode 19 and the occurrence of bur from the land electrode 19 can be prevented.