发明名称 |
COMPOSITIONS AND METHODS FOR REDUCED FOOD ADHESION |
摘要 |
The invention relates to compositions and methods for reducing food deposit adhesion to cookware. More specifically this invention relates to a resin composition having a glass transition temperature of at least 180 DEG C containing an amount of at least one fluorinated compound, optionally also containing at least one additive selected from fatty acid esters, fatty acid amide, anionic surfactant, or a mixture containing at least one of the foregoing, to reduce food deposit adhesion on cookware made from the composition. The invention also relates to a method for providing plastic cookware having reduced food deposit adhesion. |
申请公布号 |
WO0064981(A1) |
申请公布日期 |
2000.11.02 |
申请号 |
WO2000US08912 |
申请日期 |
2000.04.04 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
LENSVELT, CORNELIS, JOHANNES;PENNING, JAN, PAUL;PUYENBROEK, ROBERT |
分类号 |
A47J36/02;C08J5/00;C08K3/00;C08K5/00;C08K5/10;C08K5/20;C08K5/54;C08L27/12;C08L79/08;C08L83/08;C08L101/00 |
主分类号 |
A47J36/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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