| 摘要 |
PURPOSE: A molding apparatus of a semiconductor package is provided to mold lead frames in a constant shape by a single operation of rams detachably fixed to a multi-plunger using an epoxy molding compound(EMC) in a die groove of a molding fixture. CONSTITUTION: The molding apparatus includes an upper mode die(20) and a lower mold die(40). The upper mold die(20) consists of an upper press(22) molded on the top of the upper mold die(20), a main plunger(21) vertically rotatably mounted between the upper presses(22), a multi-plunger(90) geared with the main plunger(21), and upper/lower drive plates(23,25) coupled by sub-posts(24), for fixing/supporting the multi-plunger(90). The upper mold die(20) further includes another lower drive plate(28) provided at the bottom of the lower drive plate(25) and detachably mounted by a bolt(27) and a nut(26), an upper die bay(31) attached to the bottom of the another drive plate(28) and having a loading fixture(50) therein, and an upper chase block(60) fixed to the bottom of the upper die base(31). The lower mole die(40) includes a lower press(43) mounted to the main post(44), an upper die base(42) mounted to the top of the lower press(43), and a lower chase block(70) mounted on the top of the upper die base(42).
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