METHOD AND DEVICE FOR COATING PHOTORESIST

摘要

PURPOSE: A method for applying a photoresist film is provided to improve the uniformity of a photoresist film applied in a photolithography process. CONSTITUTION: A method for applying a photoresist film includes a rotation axis(10) for rotating a wafer(12) within a chamber(14) and a chuck(11) in which the wafer(12) is located on the rotation axis(10). A passage(20) for supplying a gas(18) from the outside in order to maintain the temperature and humidity of an internal air is formed on the top of the chamber(14). An inner cup(16) is installed at the bottom of the chuck(11). An outer cup(15) is installed on the top of the chuck(11). Thus, contamination of the rear side of the equipment or the wafer due to chemical material can be prevented when the wafer(12) is rotated, and the flow of the air(18) supplied from the outside can be induced in a constant direction.