| 摘要 |
PROBLEM TO BE SOLVED: To provide a flattening method of a semiconductor film surface for easily flattening a surface of a semiconductor film in which concave and convex portions exist. SOLUTION: Ceramics grains are blown to a surface of a semiconductor film 1 formed on an approximately whole surface of the substrate 2 using an abrasive grain discharge nozzle 3. The abrasive grain discharge nozzle 3 repeats a high speed reciprocating movement in an X direction at a constant period while it injects ceramic grains 4, i.e., abrasive grains. The ceramic particles 4 is blown to a whole surface of the semiconductor film 1 by moving the substrate 2 to a Y direction against the abrasive grain discharge nozzle 3. Thereby, a flattening processing is carried out.
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