| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition having good flowability, excellent moldability, excellent soldering heat resistance, good adhesiveness and excellent moisture resistance, giving little warpage to a package and causing no resin cracks by blending an epoxy resin, a phenol resin, an inorganic filler and a curing promoter as its essential components and specifying the content of the inorganic filler. SOLUTION: An epoxy resin of formula I (wherein R1 is CjH2j+1; R2 is CkH2k+1; R3 is ClH2l+1; R4 is CmH2m+1; (j), (k), (l) and (m) are each 0 or more; and (n) is 1 or more) is used. A phenol resin of formula II (wherein R1, R2, (j), (k), (n) are each the same with that of formula I; and (m) is 1 or more) is used. A preferable inorganic filler to be used is a silica power having an average size of not more than 30μm. The content of the inorganic filler is 50-95 wt.% of the resin composition. A curing promoter to be used is a phosphoric curing promoter, an imidazole curing promoter, DBU curing promoter or the like. The content of the curing promoter is 0.01-5 wt.% of the resin composition.
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