发明名称 Multi-part lead frame with dissimilar materials and method of manufacturing
摘要 A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.
申请公布号 US6140154(A) 申请公布日期 2000.10.31
申请号 US19990339284 申请日期 1999.06.23
申请人 MICRON TECHNOLOGY, INC. 发明人 HINKLE, S. DEREK;BROOKS, JERRY M.;CORISIS, DAVID J.
分类号 H01L23/495;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 主分类号 H01L23/495
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