Thermal bonding method and apparatus

摘要

A thermal bonding method wherein at least two members are thermally bonded to each other with an adhesive by pressing and heating a laminate formed by laminating at least two members on each other with the adhesive interposed therebetween, comprising placing at least one member of the laminate close to a heated radiation heater and pressing the laminate in a radiation heat-applied state; and an apparatus comprising a radiation heater, a supporting member for supporting the laminate with at least one member of the laminate placed close to the radiation heater, and a pressing unit adapted to approach, contact and press the laminate supported by the supporting member and then move away from the laminate to stop applying a pressure to the same.