发明名称 LEAD FRAME AND SEMICONDUCTOR PACKAGE HAVING HEAT SINK USING THE SAME
摘要 PROBLEM TO BE SOLVED: To suppress the occurrence of voids at molding time by controlling the intervals and widths of leads in the positioned direction of a molded runner gate area. SOLUTION: Many inner leads 11 are radially arranged at fixed intervals so as to form a square space section 14 for positioning a semiconductor chip. The outer ends of the inner leads 11 are supported by the insides of dam bars 19, and the inner ends of outer leads 12 are supported by the outsides of the dam bars 19. In addition, the other ends of the outer leads 12 are integrally connected to a frame. The dam bars 19 not only support the inner and outer leads 11 and 12, but also prevent a molten molding resin from leaking out to the spaces among the inner leads 12. In order to form a molded resin section, an initial sealing resin introducing area 18 into which the molten molding resin is injected through a mold runner is provided. In addition, an air-vent area 17 is provided to discharge the air in the cavity of a mold when the molten molding resin flows in the cavity.
申请公布号 JP2000299420(A) 申请公布日期 2000.10.24
申请号 JP19990271338 申请日期 1999.09.24
申请人 ANAM SEMICONDUCTOR INC 发明人 KIN KISEI;KIN SHOMO;RI CHINAN
分类号 H01L23/50;H01L23/28;H01L23/433;H01L23/48;H01L23/495 主分类号 H01L23/50
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