| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the phenomenon that an insulating film shrinks in a heat treatment in forming a thin film magnetic element and the warp of the thin film magnetic element, by manufacturing an insulating film by using a fluorine containing aromatic resin. SOLUTION: A Cu conductor thin film turning to a thin film coil is formed by using a sputtering method. A coil conductor 2A is formed on an insulating board 1 by patterning in a coil shape. A fluorine containing aromatic compound is subjected to chemical vapor deposition treatment on a surface containing the coil conductor, the fluorine containing aromatic resin which has low permittivity and excellent heat resistance is formed, and an insulating film 3A of 100-20,000 nm in thickness is formed. The same processes are repeated, coil conductors 2B, 2C and insulating films 3B, 3C are laminated and multilayered further on the insulating film 3A, and a thin film magnetic element is manufactured. Since the insulating film containing fluorine containing aromatic group has a thermal expansion coefficient similar to that of the copper coil conductor, shrinking of the insulating film is not generated in the case that heat treatment is performed when the thin film magnetic element is formed, and the thin film magnetic element is not warped.
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