| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing costs by connecting at least one end of a lamination bump to an exposed part where both of the front and rear of a wiring pattern have been exposed from a circuit substrate. SOLUTION: At least one end of a lamination bump 12 is connected to an exposed part 14 where both of the front and rear of a wiring pattern 10 are exposed from a circuit substrate 16-2. In that case, an exposed part 14 where both of the front and rear of the wiring pattern 10 of a second circuit substrate 16-2 have been exposed from the second circuit substrate 16-2 is formed, and a first surface 14-1 of the exposed part 14 is placed at the top of the lamination bump 12. Then, after the first surface 14-1 of the exposed part 14 touches the top of the lamination bump 12, energy such as press, heat, and ultrasonic waves is given from the second surface 14-2 in the contact state. With the configuration, sufficient space can be secured in the lamination direction of the lamination bump 12, thus giving sufficient energy to the connection part of the lamination bump 12 and hence connecting the lamination bump 12 without using any conductive adhesive and hence reducing costs. |
