发明名称 |
Process utilizing selective TED effect when forming devices with shallow junctions |
摘要 |
A process for device fabrication in which transient enhanced diffusion (TED) is used to obtain a desired distribution of dopants in a crystalline substrate is disclosed. In the process, at least two dopants and a non-dopant are introduced into the same region of a substrate. The diffusion of the dopants in the substrate during a subsequent thermal anneal is affected by the non-dopant. The amount of non-dopant introduced into the substrate is selected to obtain, in conjunction with the subsequent thermal anneal, the desired distribution of dopants in the substrate. The concentration of the non-dopant is in the range of about 6x1016 atoms/cm3 to about 3x1021 atoms/cm3. The substrate is then annealed at a temperature in the range of about 700 DEG C. to about 950 DEG C. to obtain the desired dopant profile.
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申请公布号 |
US6136673(A) |
申请公布日期 |
2000.10.24 |
申请号 |
US19980023220 |
申请日期 |
1998.02.12 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
FREI, MICHEL RANJIT;VUONG, THI-HONG-HA;XIE, YA-HONG |
分类号 |
H01L21/22;H01L21/225;H01L21/265;H01L21/331;H01L21/8249;(IPC1-7):H01L21/22 |
主分类号 |
H01L21/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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