| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave(SAW) device capable of preventing a mounting defect in the case of mounting on a package. SOLUTION: An IDT electrode 15, a connecting electrode 16 and a metal layer 17 are formed on a piezoelectric substrate 14. Next, a negative photosensitive film resist is press-fitted on all the surface of the piezoelectric substrate 14, a sound absorbing material 18 is obtained by exposing and developing the film resist at a portion to be the sound absorbing material 18, next, the piezoelectric substrate 14 is divided to respective SAW elements 13 with a dicer while spraying water and after moisture is removed, the surface of the SAW elements 13, namely, the surface of the sound absorbing material 18 is adsorbed, moved by a carrier 30 and mounted in a package 10 coated with an adhesive 12. Next, the connecting electrode 16 of the SAW element 13 and an electrode 11 for external connection of the package 10 are electrically connected by a wire 19 and the opening part of the package 10 is sealed by a lid 20. |
