| 摘要 |
PROBLEM TO BE SOLVED: To reduce work processes related to a mounting method for a composite wiring board where individual parts are mounted, with the composite wiring board comprising a rigid wiring board and flexible wiring board pasted together. SOLUTION: A process where the terminal of wiring pattern of a rigid wiring board 12 is electrically connected to that of a flexible wiring board 11, and a process where an individual part 6 is mounted on a composite wiring board 13, are performed in the same solder connection process. Here, the flexible wiring board 11 is provided with a land 7 and hole 8 for connection, and the solder connection process comprises a solder applying process for solder-printing with a mask and a solder reflow process for soldering with solder reflow. |
