| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive film, which suppresses deterioration of the adhesion force and of reliability of an anisotropic conductive film, and can suppress inclining of a conduction path at thermal press-sticking with a semiconductor element and a circuit board. SOLUTION: This anisotropic conductive film 1, where plural conduction paths 2 are mutually insulated and pass through an insulating film 3 in the direction of the thickness, is used. The anisotropic conductive film 1 is inserted between a semiconductor element 4 and a circuit board 6, and it is jointed to the semiconductor element 4 and the circuit board 6 under the condition that the melt viscosity of a material forming the insulating film 3 become 10 Pa.s-300 Pa.s. |
