| 摘要 |
PROBLEM TO BE SOLVED: To prevent an inner lead from being bent by an external force, improve yield, and to prevent a short circuit of unintended parts of a wiring and a semiconductor device on a base film under the influence of heat at bonding. SOLUTION: A conductor wiring 3 is provided on a base film 52 so that its one end does not protrude to an opening 2, and further openings 4 are provided at four corners of the opening 2 on the base film 52. As a result, an inner lead 3a is prevented from being bent by an external force, and further the base film 52 including the inner lead 3a is formed easily into a desired forming shape. |
