发明名称 BUMP INSPECTION METHOD AND ITS INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To remove height error data caused by multiple reflection effectively and carry out more accurate bump height detection by moving a position of a first regular reflection region according to a value based on a value of corresponding height data and a given angle. SOLUTION: As for a first regular reflection region 50b which is a reflection region from a bump and multiple reflection regions 51b, 52b, corresponding height datastored in a height data region is read for each unit picture element 500b constituting them. Then, each unit picture element 500b is moved according to a value corresponding to h/tan (θ) in a first reflection image from an original position in a reverse direction of first irradiation light by a position of the unit picture element 500b, read out height data (h) and an angle θ, and is made a unit picture element 501b.
申请公布号 JP2000294590(A) 申请公布日期 2000.10.20
申请号 JP19990099440 申请日期 1999.04.06
申请人 FUJITSU LTD 发明人 TAKAHASHI FUMIYUKI;TSUKAHARA HIROYUKI;OSHIMA YOSHITAKA;NISHIYAMA YOJI;FUSE TAKASHI
分类号 G01B11/24;G01N21/956;H01L21/60 主分类号 G01B11/24
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