| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the adhesive power of adhesion resin agasint a base board and to improve the electric connection reliability of a semiconductor chip and a wiring board in the circuit board of structure where the semiconductor chip is mounted on the base board through the use of adhesion resin. SOLUTION: In a circuit board, an input wiring 420a, an output wiring 420b and a dummy wiring layer 422 are formed on the IC chip mounting area of a base film 410 having insulating property and flexibility and an IC chip 450 is mounted and formed through an anisotropic conduction film where conductive particles 21 are dispersed in adhesion resin 19. The dummy wiring layer 422 is insulated from the input wiring 420a, the output wiring 420b and the electrodes 450a and 450b of the IC chip, and several opening parts 422a are installed.</p> |
