发明名称 LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To obtain a lead frame which can secure a flat width of a bonding part even by narrowing the pitch of inner leads. SOLUTION: Wider-width bonding parts 9 and narrower-width parts 10 continuous to the bonding parts 9 are formed at tip ends of inner leads 3 arranged in parallel. When a reference line L denotes a line passing through tip ends of the inner leads 3 which form parts of the bonding parts 9 and which are close to an island 5, the bonding part 9 of one of the alternately arranged inner leads 3 is positioned as spaced from the bonding part 9 of the other inner lead with respect to the reference line L.
申请公布号 JP2000294716(A) 申请公布日期 2000.10.20
申请号 JP19990095389 申请日期 1999.04.01
申请人 NICHIDEN SEIMITSU KOGYO KK 发明人 ISHIHARA TAKAO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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