| 摘要 |
A thermal coupling arrangement for coupling of dissipative electrical components (4a-d) to a metal housing base-plate (1) functioning as a heat-sink, includes a circuit board (3) with the electrical components (4a-c) arranged on its surface, and a metal base (2) arranged on the base-plate and used for mounting of the circuit-board (3). The metal base (2) has at least one surface recess (10) in which an electrical component (4d) mounted on the bottom of the circuit-board (3) can be accommodated. The circuit-board is specifically a ceramic substrate fixed on the metal base (2) by means of a heat-conducting adhesive. |
